عنوان مقاله
تکنولوژیهای مونتاژ و سیم کشی برروی پلتفرم هایPLC برای برنامه های کاربردی پرسرعت و کم هزینه
فهرست مطالب
مقدمه
پیکره بندی پایه پلتفرمPLC
تکنولوژیهای پیشنهادی برای منطقه مونتاژ دستگاه
تکنولوژی های پیشنهادی برای منطقه سیم کشی
مدول های مرکب نوری الکترونیکی با استفاده از پلتفرمPLC
خلاصه
بخشی از مقاله
مقدمه
پیکره بندی پایه پلتفرمPLC
تکنولوژیهای پیشنهادی برای منطقه مونتاژ دستگاه
تکنولوژی های پیشنهادی برای منطقه سیم کشی
مدول های مرکب نوری الکترونیکی با استفاده از پلتفرمPLC
خلاصه
کلمات کلیدی:
Assembly and Wiring Technologies on PLC Platforms for Low-Cost and High-speed Applications Yuji Akahori, Takaharu Ohyama, Toshikazu Hashimoto, and Yasufumi Yamada Nl'T Opto-electronics Laboratories 162 Tokai, Ibaraki, 3 19- 11 Japan +8 1 29 287 7665 (Voice), +81 29 287 7887(Fax), akahori@iba.iecl.ntt,co.jp(Email) Abstract The hybrid integration of silica-based planar lightwave circuit (PLC) platforms and semiconductor opto-electronic devices is a technology that shows promise for the development of highly functional opto-electronic modules. These modules are expected to offer both optical signal and electrical signal processing functions. The silica PLC has already realized various optical signal processing functions such as those in the couplers, the switchs and the arrayed waveguide grating (AWG) wavelength multiplexers. Therefore, the technologies to improve the performance of electrical circuits on PLC platforms are significant to realize high-functional opto-electronic modules. We introduced a PLC platform with a silica-on-terraced silicon (STS) structure. Using the PLC platform, we can easily align optoelectronic devices to the silica wave guide. However, the silicon substrate caused parasitic capacitance and propagation loss in the electrical circuits on the platform. We developed several technologies to improve the electrical circuit performance of the PLC platform considering both low-cost and high-speed applications. The PLC platform for a low-cost applications employed thin film solder with a small silicon terrace area and wires on the overcladding. These technologies could decrease the parasitic capacitance and also could realize the simple structure that suited low-cost applications. The SO-Mbit/s optical wavelength-division multiplexing (WDM) transceiver that employed these technologies showed excellent receiver sensitivity of -37 dBm at a burst signal of 50-Mbids. The PLC platform for high-speed applications used solder bumps and coplanar transmission lines. These technologies could minimize the CR time constant and electrical propagation loss of coplanar transmission lines. These technologies were applied to wide-bandwidth transmitter and receiver modules. The transmitter module showed a very wide 3-dB bandwidth of 11 GHz and the receiver module also showed a wide 3-dB bandwidth of 8 GHz. These modules operated successfully at a 10-Gbith NRZ signal with a receiver sensitivity of -8 dBm. The excellent performance of the WDM transceiver module and the 10-Gbitls transmitter and receiver modules indicated that the technologies employed in these PLC platforms effectively suppress electrical deterioration due to the use of a silicon substrate.
